|
Data Rate |
Description |
Details |
|
CW |
1.5 um High power DFB chip, CW, DWDM |
|
|
2.5 Gb/s |
1.3 um FP chip for Uncooled applications up to 10 km |
|
|
2.5 Gb/s |
1.3 um DFB chip for Uncooled applications up to 40 km, & CATV |
|
|
2.5 Gb/s |
1.3 um DFB chip for Uncooled applications (CWDM) |
|
|
2.5 Gb/s |
1.3 um Expanded Beam (XBL) DFB chip for Uncooled applications up to 40 km |
|
|
2.5 Gb/s |
1.5 um DFB chip for Uncooled applications up to 80 km |
|
|
2.5 Gb/s |
1.5 um DFB chip for Unooled applications up to 80 km, CWDM |
|
|
2.5 Gb/s |
1.5 um DFB chip for Cooled applications up to 200 km, DWDM |
|
|
2.5 Gb/s |
1.5 um EML chip for Cooled applications up to 640 km, DWDM |
|
|
2.5 Gb/s |
APD chip/ chip on carrier |
|
|
2.5 Gb/s |
1.3 um DFB chip in TO-can for 40 km Uncooled applications |
|
|
2.5 Gb/s |
1.3 um DFB chip in TO Can for Uncooled applications (CWDM) |
|
|
2.5 Gb/s |
1.5 um DFB chip in TO can for 80 km applications |
|
|
2.5 Gb/s |
1.5 um DFB chip in TO-can for up to 80 km uncooled applications, CWDM |
|
|
2.5 Gb/s |
1.49 um DFB chip in TO-can for FTTx applications |
|
|
2.5 Gb/s |
1.5 um DFB chip in TO-can for 80km uncooled applications |
|
|
10 Gb/s |
1.3 um DFB chip for Uncooled applications up to 20 km |
|
|
10 Gb/s |
1.3 um FP Chip for Wide-Temperature Uncooled applications up to 1km |
|
|
10 Gb/s |
1.3 um DFB Chip for Wide-Temperature Uncooled applications up to 20km |
|
|
10 Gb/s |
1.5 um EML chip for Cooled applications, DWDM |
|
|
10 Gb/s |
APD chip/ chip on carrier |
124EAT |
|
10 Gb/s |
1.3 um FP Chip in TO Can for Wide-Temperature Uncooled applications to 1km |
TO299K |
|
10 Gb/s |
1.3 um DFB Chip in TO Can for Wide-Temperature Uncooled applications up to 20km |
TO293K |
