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Products ¡¡
High Precision adhesives
AT4291A/AT9290F/GA800E2
Product Description£º

Special Features

  • Minimal position changes due to curing time and temperature change allowing for even submicron order adhesion.
    * Shrinkage rate during curing is very small (less than 3%)
    * Thermal expansion coefficient is small (less than 4×10-5/°C)
  • AT9290F is transparent upon curing.

Specifications

Model#
[Main
ingredient]		 Curing
conditions
[irradiation
level &
time]		 Curing
Shrinkage
Rate (%)		 Viscosity
(cP)		 Glass
transition
temperature
Tg (°C)		 Thermal
Expansion
Coefficient
(10-5/°C		 Bond
Strength
(kgf/cm2)		 Special
Features
AT4291A
[Epoxy](*1)		 50mW/cm2
10min		 2~3 >20,000 205 2 >116 Small curing shrinkage rate
Small thermal expansion coefficient rate
AT9290F
[Epoxy](*1)		 50mW/cm2
10min		 1~2 >20,000 140 4 >200 Small curing shrinkage rate
Small thermal expansion coefficient rateLarge curing depth
GA800E2
[Epoxy]		 50mW/cm2
10min		 2 >20,000 118 4.5 >136 Small curing shrinkage rate
Small thermal expansion coefficient rate
*1 : Content product is "Non-medical use, deleterious substance" (Please refer to MSDS for handling.)
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