CyOptics是业内领先的单片集成和混合集成器件的供应商，主要设计开发销售用于光纤接入、城域和长途通信系统的全系列InP光器件芯片和元器件。其主要产品有各种激光器件和接收器件芯片、TO Can、双列直插和蝶形封装的激光器/接收模块和组件。由于CyOptics采用全自动的微细加工技术，保证了其产品具有优良的性能参数、高度的一致性和较低成本。

 

Data Rate	Description	PN
2.5 Gb/s	1.5 um Cooled DFB MSA TOSA, 120km, DWDM	1610
2.5 Gb/s	1.5 um Cooled DFB MSA TOSA, 200km, DWDM	1611
4.25 Gb/s	1.5 um Cooled DFB MSA TOSA, 80km, DWDM	1608
10 Gb/s	1.5 um Cooled EML XMD MSA TOSA, 40km, DWDM	1625
10 Gb/s	1.5 um Cooled EML XMD MSA TOSA, 80km, DWDM	1626
10 Gb/s	PIN ROSA with TIA	1640
10 Gb/s	PIN ROSA with Linear TIA	1640L1
10 Gb/s	APD ROSA with TIA	1641
10 Gb/s	APD ROSA with Linear TIA	1641L1
10 Gb/s	XMD APD ROSA with TIA	1644
10 Gb/s	1.3 um Uncooled EML TOSA	A15x
10 Gb/s	1.3 um Uncooled XMD DFB TOSA for Wide-Temperature Uncooled applications	TX293K
10 Gb/s	1.3 um Ucooled XMD CWDM TOSA for Wide-Temperature Uncooled applications	TX293K-CWDM
10 Gb/s	1.3 um Uncooled XMD Fabry Perot TOSA for Wide-Temperature Uncooled applications	TX299K

Data Rate	Description	Details
CW	1.5 um High power DFB chip, CW, DWDM	295M
2.5 Gb/s	1.3 um FP chip for Uncooled applications up to 10 km	299F
2.5 Gb/s	1.3 um DFB chip for Uncooled applications up to 40 km, & CATV	293BU
2.5 Gb/s	1.3 um DFB chip for Uncooled applications (CWDM)	293Bxxx
2.5 Gb/s	1.3 um Expanded Beam (XBL) DFB chip for Uncooled applications up to 40 km	293C
2.5 Gb/s	1.5 um DFB chip for Uncooled applications up to 80 km	295J155
2.5 Gb/s	1.5 um DFB chip for Unooled applications up to 80 km, CWDM	295Jxxx
2.5 Gb/s	1.5 um DFB chip for Cooled applications up to 200 km, DWDM	295L
2.5 Gb/s	1.5 um EML chip for Cooled applications up to 640 km, DWDM	294W
2.5 Gb/s	APD chip/ chip on carrier	124NLV
2.5 Gb/s	1.3 um DFB chip in TO-can for 40 km Uncooled applications	TO293Bx
2.5 Gb/s	1.3 um DFB chip in TO Can for Uncooled applications (CWDM)	TO293Bxxx
2.5 Gb/s	1.5 um DFB chip in TO can for 80 km applications	TO295J
2.5 Gb/s	1.5 um DFB chip in TO-can for up to 80 km uncooled applications, CWDM	TO295Jxxx
2.5 Gb/s	1.49 um DFB chip in TO-can for FTTx applications	TO295J149x
2.5 Gb/s	1.5 um DFB chip in TO-can for 80km uncooled applications	TO295J155x
10 Gb/s	1.3 um DFB chip for Uncooled applications up to 20 km	293BT
10 Gb/s	1.3 um FP Chip for Wide-Temperature Uncooled applications up to 1km	299K
10 Gb/s	1.3 um DFB Chip for Wide-Temperature Uncooled applications up to 20km	293K
10 Gb/s	1.5 um EML chip for Cooled applications, DWDM	294U
10 Gb/s	APD chip/ chip on carrier	124EAT
10 Gb/s	1.3 um DFP Chip in TO Can for Wide-Temperature Uncooled applications to 1km	TO299K
10 Gb/s	1.3 um DFB Chip in TO Can for Wide-Temperature Uncooled applications up to 20km	TO293K